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3D SPI Specification:

What is 3D SPI?

Principle:
　　Automatic non-contact measurement, used after the solder paste printer and before the placement machine.
　　 Relying on technical means such as structured light measurement (mainstream) or laser measurement (non-mainstream) to measure the solder paste after PCB printing (micron precision).
　　Structured light measurement principle: Set up a high-speed CCD camera in the vertical direction of the object (PCB and solder paste), and irradiate the object with periodically changing fringe light or image from an obliquely above. In the case of higher components on the PCB, an image in which the stripes are displaced relative to the base surface will be captured. Using the principle of triangulation, the offset value is converted into a height value.
　　 In order to find the bad phenomenon of solder paste in time before the reflow furnace soldering, it is a quality process control method to avoid the occurrence of unqualified PCB as much as possible.

AOI detects the definition of false welding, empty welding, false welding and cold welding in SMT welding
In today’s SMT production process, most manufacturers face different SMT process defects, such as tin bead, residue, false welding, cold welding, empty welding, tiger-in-law welding…especially the last four, many friends I can’t tell the difference between them, because these four kinds of bad things seem to be the same. Here is an explanation of the four kinds of bad things:
[1], False welding: refers to the surface seems to be welded, but in fact it is not welded. Sometimes the original device can be pulled up from the pad with a gentle pull by hand. The energization performance is affected or it is an open circuit state at all.
[2], Welding: there is a small amount of solder at the solder joints, resulting in poor contact, making and breaking. Both virtual and false welding refer to that the surface of the weldment is not fully plated with tin and there is no It is welded because the surface of the weldment is not cleaned, or the flux is used less.
[[3], empty welding: the solder joints should be soldered but not soldered, there is too little tin, the part itself is problematic, the placement problem, the printing tin is left for too long and the empty welding is caused. [4]. Cold soldering: There is no tin strip formed on the tin interface of the part (that is, the solder is poor). If the flow soldering temperature is too low, the flow soldering time is too short, and the tin-eating problem will cause cold soldering.