AOIs for a PCB board with components may inspect the following features:

• Area defects
• Billboarding
• Component offset
• Component polarity
• Component presence or absence
• Component Skew
• Excessive Solder Joints
• Flipped component
• Height Defects
• Insufficient Paste around Leads
• Insufficient Solder Joints
• Lifted Leads
• No Population tests
• Paste Registration
• Severely Damaged Components
• Tombstoning
• Volume Defects
• Wrong Part
• Solder Bridging
• Presence of Foreign Material on the board

AOI can be used in the following locations in the SMT lines: post paste, pre-reflow, post-reflow, or wave areas.