Inspection system

Application

After SMT stencil printing, pre/post reflow oven, pre/post wave soldering, FPC

Program mode

Manual programming, auto programming, CAD data importing

Inspection Items

Stencil printing: Solder unavailability, insufficient or excessive solder, solder misalignment, bridging, stain, scratch etc.

Component defect: missing or excessive component, misalignment, uneven, edging, opposite mounting, wrong or bad component etc. 

DIP: Missing parts, damage parts, offset, skew, inversion, etc

Calculation Method

Machine learning, color calculation, color extraction, gray scale operation, image contrast ,  OCV/OCR etc.

Inspection mode

Optimized inspection technology covering the whole PCBA board,  support collating board inspection and multi-mark

SPC statistics function

Fully record the test data and make analysis,，with high flexibility to check production and quality status.

Component angle

Support 0～359° rotation，minimum angular distance 1°

Minimum component

01005 chip、0.3 pitch IC

Camera

5  million pix  full color high speed industrial digital camera , 20 million pix camera optional

Lens resolution

10um/15um/18um/20um/25um， can be customized

lighting source

Self-configurable ring stereo multi-channel color light source, selection depending on application, RGB/RGBW/RGBR/RWBR, coaxial light source or large light source optional

Computer system

OS

Windows 7 64bit

Display

22inch， 16:10

CPU

Inter E3 or same level

GPU

optional

RAM

16GB

HDD

1TB HDD，SSD optional

Software

Language

Chinese/English optional

Access Control

Administrator，programmer, operator 3 levels access control.